70mm x 70 mm QSeven™ (2.0) 板型
搭载高性能NXP 1.0GHz i.MX 6QuadPlus/i.MX 6DualLite ARM Cortex-A9芯片
支持-20°C ~ 70°C宽温工作范围
支持双通道18/24-bit LVDS
提供评测底板
威盛QSM-8Q60是一款ARM架构Qseven™板型模块，可选搭载图像内存性能升级的1.0GHz NXP i.MX 6QuadPlus Cortex-A9 ARM系统芯片，或1.0GHz NXP i.MX 6DualLite Cortex-A9 dual core系统芯片，完美保障了高性能和丰富多媒体功能之间的平衡。其超紧凑设计适用于各种嵌入式系统应用，如工业自动化、交通、医疗及娱乐等。
硬 件威盛QSM-8Q60尺寸为70 mm x 70 mm，完全符合Standardization Group for Embedded Technologies e.V. (SGeT)采用的Qseven™ Rev. 2.0嵌入式板型标准。支持-20°C ~ 70°C宽温工作范围，专为恶劣环境设计，提供更好的灵活性。
威盛QSM-8Q60板载 Micro SD卡槽，4GB eMMC闪存及 2GB DDR3-10666 SDRAM。同时，该模块也提供丰富的I/O接口和显示扩展选择，包括四个USB 2.0接口、一个HDMI接口、一个双通道18/24-bit LVDS面板、两个3 COM (TX/RX) 口、千兆以太网、2 CAN bus 及一个PCIe接口。
软 件威盛QSM-8Q60提供了搭载kernel (4.1.15) 及引导程序原始码的Linux BSP软件工具包，可支持基于NXP i.MX 6DualLite和 NXP i.MX 6QuadPlus系统芯片平台。其它功能包括一个帮助调整kernel及支持威盛QSMBD2开发基板界面的Tool Chain和其他硬件功能。
同时，威盛还提供整套软件客制化服务，帮助客户加快上市时间，降低开发成本。
扩展性客户可以利用我们接口丰富的评测底板和业内一流的技术支持能力开发客制化架构主板。
点击此处下载QSM-8Q60数据資料PDF版，或浏览以下信息：
| 型号 | QSM-8Q60-QP | QSM-8Q60 |
|---|---|---|
| 处理器 | 1.0GHz NXP i.MX 6QuadPlus Cortex-A9 quad-core SoC | 1.0GHz NXP i.MX 6DualLite Cortex-A9 dual-core SoC |
| 系统内存 | 2GB DDR3-1066 SDRAM | |
| 板载存储 | 4GB eMMC Flash memory | |
| Boot Loader | 4MB SPI Flash ROM | |
| 显卡 | Vivante GC2000+ GPU | Vivante GC880 |
| 3 integrated, independent 3D/2D and video graphics processing units Supports OpenGL® ES 2.0, OpenCL and OpenVG™ 1.1 hardware accleration Supports MPEG-2, VC-1and H.264 video decoding up to 1080p Supports SD encoding | 2 Independent, integrated 3D/2D graphics processing units Graphics engines support OpenGL® ES 2.0, OpenVG 1.1 hardware acceleration Supports MPEG-2, VC-1 video decoding up to 1080p | |
| LAN | Micrel KSZ9031RNX Gigabit Ethernet Transceiver with RGMII support | |
| 音频 | I2S Audio Interface | |
| HDMI | Integrated HDMI 1.4 Transmitter | |
| USB | SMSC USB2514 USB 2.0 High Speed 4-port hub controller | |
| 支持扩展 I/O | 1 PCIe x1 | |
| 扩展 I/O | 4 USB 2.0 ports 1 USB OTG client 1 HDMI port 1 Dual-channel 18/24-bit LVDS panel 1 PWM 3 COM (TX/RX) ports 1 Gigabit Ethernet 2 CAN bus 1 I2S 1 SPI 1 SDIO/GPIO 1 I2C | |
| 板载 I/O | 1 Micro SD card slot | |
| 操作系统 | Linux kernel 4.1.15 | Linux kernel 3.14.28 |
| 工作温度 | -20°C ~ 70°C | |
| 存储温度 | -20°C ~ 70°C | |
| 工作湿度 | 0% ~ 95% (non-condensing) | |
| 产品尺寸 | 7.0cm x 7.0cm (2.76" x 2.76") | |
| 认证 | Qseven™ Rev. 2.0 module | |
1 Dual-channel 18/24-bit LVDS panel
1 PWM
3 COM (TX/RX) ports
1 Gigabit Ethernet
2 CAN bus
1 I2S
1 SPI
1 SDIO/GPIO
1 I2C
板载 I/O1 Micro SD card slot
操作系统Linux kernel 4.1.15Linux kernel 3.14.28
工作温度-20°C ~ 70°C
存储温度-20°C ~ 70°C
工作湿度0% ~ 95% (non-condensing)
产品尺寸7.0cm x 7.0cm (2.76" x 2.76")
认证Qseven™ Rev. 2.0 module
| 文件 | 版本 | 日期 |
|---|---|---|
| 设计指南 | v1.00 | 2020-09-02 |
| 用户手册 | v1.04 | 2020-09-02 |
| Linux | ||
| Linux 开发指南 for BSP v3.0.2 | v1.00 | 2018-03-09 |
| Linux 快速入门指南 for EVK v3.0.2 | v1.00 | 2018-03-09 |
| 软件 | 版本 | 日期 |
|---|---|---|
| Linux Board Support Package (BSP) 5.8GB | v3.0.2 | 2018-03-09 |
| Linux Evaluaiton Kit (EVK) 380.3MB | v3.0.2 | 2018-03-09 |
重要: 一旦下载该系列软件包，表明您已同意软件许可协议。如您不同意软件协议的任何条款和条件，请不要继续下载该软件。
U-Boot version: 2015.04
Kernel version: 4.1.15
Evaluation image: OpenEmbedded-core built with Yocto 2.0 Jethro
Development based on NXP fsl-yocto-L4.1.15_1.1.0-ga (Yocto 2.0 Jethro)
Support SPI with eMMC or Micro SD boot (default)
Support HDMI or LVDS single display (default HDMI output)
Support HDMI audio output
Support AUO LVDS resistive touch panels (through USB interface)
AUO 10.4″ G104XVN01.0 (1024×768)
AUO 7″ G070VW01 (800×480)
Supports COM1 and COM3 (TX/RX), COM2 as debug port
Supports COM4, COM5, COM6 and COM7 (RS-232 / RS-422 / RS-485)
Supports 2 CAN bus (TX/RX)
Supports Gigabit Ethernet (LAN1)
Supports 10/100Mbps Ethernet (LAN2)
Supports Line-in, Line-out, Mic-in
Supports VNT9271 USB Wi-Fi dongle
Supports EMIO-2531 miniPCIe Wi-Fi & BT module
Supports Bluetooth A2DP and SPP profile
Supports EMIO-1541 miniPCIe Wi-Fi module
Supports GPIO, RTC and Watchdog Timer
BSP v3.0.2 Bug Fixes and Modifications
Changed CPU settings back to NXP default.
Fixed a u-boot bug that was showing incorrect low temperature.
Fixed a kernel bug that caused system boot hangs on HDMI at high temperature.
| 型号 | SoC | 描述 |
|---|---|---|
| 10GEC10H40020 | NXP i.MX 6QuadPlus Cortex-A9 @ 1.0GHz | Qseven™ module with 1.0GHz NXP i.MX 6QuadPlus Cortex-A9, 4GB eMMC, 4MB SPI ROM,2GB DDR3 SDRAM, HDMI, 4 USB 2.0, 1 USB OTG client, LVDS, 3 COM (TX/RX), 2 CAN bus,Gigabit Ethernet, 10/100Mbps Ethernet, PCIe x1, Micro SD card slo |
| 10GEC10700020 | NXP i.MX 6DualLite Cortex-A9 @ 1.0GHz | QsevenTM module with 1.0GHz NXP i.MX 6DualLite Cortex-A9, 4GB eMMC, 4MB SPI ROM,2GB DDR3 SDRAM, HDMI, 4 USB 2.0, 1 USB OTG client, LVDS, 3 COM (TX/RX), 2 CAN bus,Gigabit Ethernet, 10/100Mbps Ethernet, PCIe x1, Micro SD card slo |
| 10GFL00000020 | N/A | QSM-8Q60 evaluation carrier board (QSMDB2) with CAN bus cable and DC power cable |
| 型号 | 描述 |
|---|---|
| 00GO27100BU2B0D0 | VNT9271 IEEE 802.11b/g/n USB Wi-Fi dongle |
| EMIO-2531-00A1 | VAB-820-W-M IEEE 802.11b/g/n miniPCIe Wi-Fi & Bluetooth module with assembly kit and antenna |
400-818-5166
